Ceramic Solutions
- Engineered Ceramic Solutions
- Heating Applications
Stainless Steel and Borosilicate Glass Heaters – Formulated with a Borosilicate glass dielectric layer, these heaters enable high temperature generation and robust electrical functionality for lower costs.
Applications: High-temperature heaters that require extremely rapid thermal cycling with thermal uniformity, may require multiple heating zones, and/or sensor-feedback temperature control is required.
- Engineered Ceramic Solutions
Ceramic parts are made from inorganic, non-metallic materials and provide high functionality for components in equipment and devices with diverse functions. With their crystalline, partly crystalline, and amorphous glass structure, engineered ceramics have solved numerus problems in electrical, chemical, and mechanical applications.
The high heat resistance of ceramics enables them function when metal and polymers are unsuitable. Ceramics composition can be tailored for suitability for use in both active (carrying electric signal) and passive parts, and can be manufactured into a multitude of shapes and sizes with green machining, lapping, drilling, sintering, laser machining, and polishing. Our ceramics can be metalized and brazed to your specifications.
Fralock’s ceramics encompass a wide range of thermal conductivities. Aluminum Nitride (AlN) heaters reach up to 180W/mK, heaters made with alumina are capable of 15 W/mK to 20 W/mK, and zirconia-based heating products achieve 2.7 W/mK. High thermally conductive ceramics may also be used as heat spreaders with dielectric capabilities. Lower thermal conductive materials can be used as thermal breaks or insulators, and can be coupled with high thermally conductive AlN heaters. Depending on your needs, you can count on us to utilize optimal materials for your requirements.
Engineered ceramics are used in a wide range of industries including semiconductor manufacturing, medicine and life science, aerospace, military defense, electronics, industrial and transmission electricity, and energy production.
- Heating Applications
Layered Ceramic Heaters – Using a unique formulation of Aluminum Nitride ceramic with co-fired internal Tungsten (W) traces for heating and temperature sensing, we design and manufacture rapid-fire heaters with exceptional thermal uniformity, watt density, and temperature ramping capabilities for use in semiconductor wafer fabrication, aerospace and defense, and medical applications. With rapid heating up to 300ºC/second, this laminated material can be configured in many shapes and sizes and precision-machined with air or fluid channels that enhance cooling.
Stainless Steel and Borosilicate Glass Heaters – Formulated with a Borosilicate glass dielectric layer, these heaters enable high temperature generation and robust electrical functionality for lower costs.
Applications: High-temperature heaters that require extremely rapid thermal cycling with thermal uniformity, may require multiple heating zones, and/or sensor-feedback temperature control is required.
- Engineered Structural Ceramics
Our expertise in precise machining provides structural ceramics to fit your needs.
Used in medical, electronics, and industrial applications, Fralock employs several methodologies to ensure your specs are met with a minimum highly controlled shrinkage.
Products Include:
- Edge rings
- End effectors
- Ceramic pins
- Showerheads for semiconductor manufacturing
- Medical device ceramic casings
- High voltage insulators
- Fluid valves
- Medical implantable devices
- Pressure plates
- Wafer chucks
- Ceramic valves for medical applications
- X-Ray machine components
- Solid state battery substrates
- Implantable feedthrough ceramics
Ceramics
- Alumina
- Zirconia
- Alumina Nitride (AlN)
- Silicon Nitride (SiN)
- Boron Nitride (BN)
- Silicon Carbide (SiC)
Glass
- Fused Quartz
- Fused Silica
- Sapphire
- ULE / Zerodure (low CTE glasses)
- Silicon
- BK7 (optical glass)
- Borosilicate
- Germanium
- Low-Temperature Co-fired Ceramics (LTCC)
Fralock is a provider of multi-layer metallization and ceramic packages for use in electronic components such as resistors, capacitors, inductors, hybrid circuits, and transformers.
We provide:
- Prototype to volume production
- Ferro, Dupont and Heraeus LTCC systems
- Multiple substrates and packages for custom applications
- Buried resistors to +/- 10%
- Aluminum nitride
- Prototype to volume production
- Quick turn protoyping
- All gold & mixed material systems
- Buried passives – resistors, capacitors & inductors
- Integrated package assembly
- Integrated passives
- Ceramic sawing and green cutting
- Electroless plating of TF conductors
- Thin Film circuits
Thin-film fine lines and traces are produced by sputtering metal on ceramic substrates and then using photolithography to etch back fine lines and spacings. Line trace widths of 0.0005 inches are possible using this technology.
RF Packages
Due to its ability to sputter fine line traces of gold on ceramic substrates this type of circuit is ideal for the challenges of RF circuits.
Fine Line Metalized Circuits – In addition to RF circuits, thin film substrates are ideal for high-density surface interconnects. The ability to configure dense circuits with high reliability can provide solutions for complex designs needed for military applications.
